Precision Glass Slicing & Dicing
Precision slicing and dicing is used when glass components require tighter dimensional control than standard cutting methods can provide.
Two primary cutting systems are used for this work:
- X-Y Precision Saw — used for precision sawing and controlled slicing of glass substrates.
- TLC Scribe Cutter — used where high-precision scribe cutting is the appropriate process.
These processes are particularly suited to thin glass, specialty glass, optical filters and wafer-format components.
Get a QuotePrecision Glass Cutting Customization
Precision slicing and dicing can be applied to standard glass dimensions, wafer formats and custom parts according to the required glass material and finished geometry.
Corning® Gorilla® Glass
Precision slicing and dicing for chemically strengthen-able cover glass and thin protective components.
SCHOTT BOROFLOAT®
Precision cutting for technical and optical borosilicate components.
Ultra-Thin Glass
Controlled cutting for thin substrates that require careful handling and precise part geometry.
Bandpass Filters
Precision sizing and dicing of coated optical filter components.
AR & Non-Glare Glass
Precision processing of glass that already carries an optical or surface treatment.
Mirrored & Specialty Glass
Slicing and dicing for reflective and specialty glass products.
Precision Glass Cutting Capabilities
- 01
X-Y Precision Sawing
High-precision slicing and dicing for glass parts and substrates requiring tightly controlled finished geometry.
- 02
Precision Scribe Cutting
TLC scribe processing for thin and precision glass components.
- 03
Wafer Slicing & Dicing
Custom slicing and dicing is available for standard wafer sizes and wafer-format glass components.
- 04
Turn-Key Glass Fabrication
Precision-cut glass can continue through chemical strengthening, screen printing and optical coating to produce a finished glass component.
Specialty Packaging for Precision-Cut Glass
Precision-cut wafers and sensitive glass components can be packed using different methods according to surface quality, part size and handling requirements.
| Packaging Option | Function | Production Capability |
|---|---|---|
| Plastic Wafer Containers | Individual-cell packaging without paper contact | For glass wafers with special surface requirements |
| Wafer Container Thickness Range | Controls compatible wafer thickness | Maximum part thickness: 1.75 mm [0.069 in] |
| Wafer Container Diameter | Supports large wafer-format parts | Maximum part diameter: 400 mm [15.748 in] |
| pH-Neutral Paper | Separates sensitive glass surfaces | Available |
| Silica Gel Packets | Moisture control during packaging and shipment | Available |
| Heat Shrinking | Secures packaged glass components | Available |
| Foam / Plastic Trays | Custom handling and part separation | Available |
Glass Materials for Precision Slicing & Dicing
Precision glass cutting can be applied to:
- Corning® Gorilla® Glass
- SCHOTT BOROFLOAT®
- SCHOTT AS87
- SCHOTT D263
- Anti-Reflective Glass
- Non-Glare Glass
- Ultra-Thin Glass
- Mirrored Products
- Bandpass Filters
- Specialty Glass
The required cutting method is selected according to the glass construction, thickness, surface condition and finished-part specification.
Contact Us
Need precision slicing or dicing for glass wafers, optical filters, ultra-thin substrates or coated glass components?
Send the glass material, thickness, dimensions, required tolerance and drawing for review.
Related Glass Fabrication Processes
Chemical Strengthening
Precision-cut components can be chemically strengthened after fabrication when increased impact and surface strength are required.
Screen Printing
Borders, graphics, functional printing and other printed features can be added to the fabricated glass component.
Optical Coatings
Anti-reflection and other optical coatings can be combined with precision-cut substrates as part of a turn-key finished glass solution.